The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2013
Filed:
Aug. 16, 2011
Chau-chin Su, Taipei, TW;
Ying-chieh Ho, Zhubei, TW;
Po-hsiang Huang, Tainan, TW;
National Chiao Tung University, Hsinchu, TW;
Abstract
A chip-to-chip multi-signaling communication system with common conductive layer, which comprises a first chip, a second chip, and a common conductive layer, is disclosed. The first chip has at least a first metal pad and a second metal pad. The second chip has at least a first metal pad and a second metal pad. The common conductive layer is to a conductive material and glued directly to the first chip and the second chip. Wherein, the first metal pad of the second chip is aligned with the first metal pad of the first chip for receiving the signal from the first metal pad of the first chip through the common conductive layer. The interference generated by other pads of the first and the second chips is suppressed by the design of the pads and the common conductive layer.