The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2013
Filed:
Sep. 27, 2007
Takahiro Asai, Kawasaki, JP;
Koichi Misumi, Kawasaki, JP;
Atsushi Miyanari, Kawasaki, JP;
Yoshihiro Inao, Kawasaki, JP;
Akihiko Nakamura, Kawasaki, JP;
Takahiro Asai, Kawasaki, JP;
Koichi Misumi, Kawasaki, JP;
Atsushi Miyanari, Kawasaki, JP;
Yoshihiro Inao, Kawasaki, JP;
Akihiko Nakamura, Kawasaki, JP;
Tokyo Ohka Kogyo Co., Ltd., Kanagawa, JP;
Abstract
An adhesive composition of the present invention includes, as a main component, a polymer produced by copolymerization of a monomer composition including: styrene; a (meth)acrylic acid alkyl ester having a chain structure; a (meth)acrylic acid ester having an aliphatic ring; and a (meth)acrylic acid ester having an aromatic ring, wherein: the styrene is contained in a range of 40 to 69 parts by mass; the (meth)acrylic acid alkyl ester having the chain structure is contained in a range of 20 to 30 parts by mass; the (meth)acrylic acid ester having the aliphatic ring is contained in a range of 10 to 25 parts by mass; and the (meth)acrylic acid ester having the aromatic ring is contained in a range of 1 to 5 parts by mass, where the total amount of the above components is 100 parts by mass. This allows for provision of an adhesive composition having high adhesive strength under high-temperature environment, as well as high heat resistance, high alkali resistance, and easiness in stripping from semiconductor wafers and the like even after high-temperature processing.