The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2013

Filed:

May. 13, 2009
Applicants:

Motoki Takahashi, Kawasaki, JP;

Toshiyuki Ogata, Kawasaki, JP;

Christopher Cordonier, Nagoya, JP;

Akimasa Nakamura, Nagoya, JP;

Tetsuya Shichi, Nagoya, JP;

Teruhiro Uematsu, Kawasaki, JP;

Inventors:

Motoki Takahashi, Kawasaki, JP;

Toshiyuki Ogata, Kawasaki, JP;

Christopher Cordonier, Nagoya, JP;

Akimasa Nakamura, Nagoya, JP;

Tetsuya Shichi, Nagoya, JP;

Teruhiro Uematsu, Kawasaki, JP;

Assignees:

Tokyo Ohka Kogyo Co., Ltd., Kawasaki-shi, JP;

Central Japan Railway Company, Nagoya-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); G03F 7/004 (2006.01); B32B 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a positive-type photosensitive composition which can form a metal compound film pattern at high resolution and with less affection by organic residues. The positive-type photosensitive composition comprises: a metal complex component (A) which can form a metal compound film when applied and subsequently fired; and a photosensitizing agent (B). In the composition, a ligand in the component (A) is preferably a multidentate ligand having an aromatic compound as its skeleton. According to this construction, even a composition containing substantially no photosensitive resin can impart photosensitivity and a metal compound film pattern can be formed readily.


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