The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
May. 22, 2009
Akio Furusawa, Osaka, JP;
Shigeaki Sakatani, Osaka, JP;
Taichi Nakamura, Osaka, JP;
Takahiro Matsuo, Osaka, JP;
Akio Furusawa, Osaka, JP;
Shigeaki Sakatani, Osaka, JP;
Taichi Nakamura, Osaka, JP;
Takahiro Matsuo, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A joint structure joins an electronic elementincluded in an electronic component to an electrodeincluded in that electronic component. The joint structure includes a solder layer, which contains 0.2 to 6% by weight of copper, 0.02 to 0.2% by weight of germanium and 93.8 to 99.78% by weight of bismuth, a nickel layer provided between the solder layer and the electrode, and a barrier layer provided between the nickel layer and the solder layer. Here, the barrier layer is formed so as to have an average thickness of from 0.5 to 4.5 μm after the electronic element and the electrode are joined by the solder layer.