The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2013

Filed:

Jun. 30, 2010
Applicants:

Toru Nakai, Ogaki, JP;

Liyi Chen, Ogaki, JP;

Inventors:

Toru Nakai, Ogaki, JP;

Liyi Chen, Ogaki, JP;

Assignee:

Ibiden Co., Ltd., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25F 3/14 (2006.01); C25D 11/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

[Subject Matter] To provide a method for manufacturing a wiring substrate where rigidity is enhanced in an insulative portion made by oxidizing aluminum. [Solution(s)] Aluminum oxide insulative portionis formed on aluminum plateas shown in FIG.(A) through anodic oxidation (FIG.(C)). Then, holes (nano-holes) () in aluminum oxideare filled with resin(FIG.(E)). Accordingly, the rigidity (strength) of insulative portionwill be enhanced and cracking will not occur during heat cycles. Also, the insulation reliability of aluminum oxide will increase, and short circuiting may be prevented at through holes(aluminum portions) separated by aluminum oxide


Find Patent Forward Citations

Nakai, Toru. (2013). Wiring substrate and method for manufacturing wiring substrate (U.S. Patent No. 8419924). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8419924

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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