The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
May. 27, 2010
Bing Dang, Chappaqua, NY (US);
John Knickerbocker, Yorktown Heights, NY (US);
Aparna Prabhakar, North White Plains, NY (US);
Peter Sorce, Poughkeepsie, NY (US);
Robert E. Trzcinski, Rhinebeck, NY (US);
Cornelia K. Tsang, Mohegan Lake, NY (US);
Bing Dang, Chappaqua, NY (US);
John Knickerbocker, Yorktown Heights, NY (US);
Aparna Prabhakar, North White Plains, NY (US);
Peter Sorce, Poughkeepsie, NY (US);
Robert E. Trzcinski, Rhinebeck, NY (US);
Cornelia K. Tsang, Mohegan Lake, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC) includes attaching the handler to the wafer using an adhesive comprising a polymer; performing edge processing to remove an excess portion of the adhesive from an edge of the handler and wafer; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer. A system for releasing a handler from a wafer, the wafer comprising an IC includes a handler attached to a wafer using an adhesive comprising a polymer; an edge processing module, the edge processing module configured to remove an excess portion of the adhesive from the edge of the handler and wafer; and a laser, the laser configured to ablate the adhesive through the handler.