The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2013

Filed:

Dec. 28, 2009
Applicants:

Liang-chia Chen, Taipei County, TW;

Shih-hsuan Kuo, Hsinchu County, TW;

Sheng-han Chen, Taipei, TW;

Yi-wei Chang, Yilan County, TW;

Hau-wei Wang, Taipei County, TW;

Inventors:

Liang-Chia Chen, Taipei County, TW;

Shih-Hsuan Kuo, Hsinchu County, TW;

Sheng-Han Chen, Taipei, TW;

Yi-Wei Chang, Yilan County, TW;

Hau-Wei Wang, Taipei County, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 21/00 (2006.01); G02B 21/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and system for three-dimensional polarization-based confocal microscopy are provided in the present disclosure for analyzing the surface profile of an object. In the present disclosure, a linear-polarizing structured light formed by an optical grating is projected on the object underlying profile measurement. By means of a set of polarizers and steps of shifting the structured light, a series of images with respect to the different image-acquired location associated with the object are obtained using confocal principle. Following this, a plurality of focus indexes respectively corresponding to a plurality of inspected pixels of each image are obtained for forming a focus curve with respect to the measuring depth and obtaining a peak value associated with each depth response curve. Finally, a depth location with respect to the peak value for each depth response curve is obtained for reconstructing the surface profile of the object.


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