The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2013

Filed:

Nov. 23, 2010
Applicants:

Kiyotaka Tsukada, Gifu, JP;

Tetsuya Muraki, Gifu, JP;

Atsunari Yamashita, Gifu, JP;

Yoshitomo Tomida, Gifu, JP;

Inventors:

Kiyotaka Tsukada, Gifu, JP;

Tetsuya Muraki, Gifu, JP;

Atsunari Yamashita, Gifu, JP;

Yoshitomo Tomida, Gifu, JP;

Assignee:

Ibiden Co., Ltd., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes a support plate having a hole formed therein and a conductor formed on a wall surface of the hole, a semiconductor element; and a conductive post formed by a conductor having a first end portion at one end, and a second end portion at an other end. The second end portion of the conductive post is connected to the semiconductor element, and a side surface of the conductive post is fixed to the conductor on the wall surface of the hole deformed by pressing force of the conductive post on a side closer to the first end portion than the second end portion.


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