The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2013
Filed:
Aug. 20, 2010
Ming LI, Fremont, CA (US);
Donald R. Mullen, Mountain View, CA (US);
Ming Li, Fremont, CA (US);
Donald R. Mullen, Mountain View, CA (US);
Rambus Inc., Sunnyvale, CA (US);
Abstract
A system includes a circuit board, a multi-die package, and a heat dissipator. The circuit board has substantially planar opposing first and second sides. The multi-die package includes a substrate and a first set of one or more semiconductor devices on a first substrate side and a second set of one or more semiconductor devices on a second substrate side. The multi-die package is located at the first circuit board side. The heat dissipator is located at the second circuit board side, and thermally coupled to the second set of semiconductor devices. One or more portions of the circuit board are removed between the first circuit board side and the second circuit board side so as to define one or more holes through the circuit board and to facilitate thermal coupling between the second set of semiconductor devices and the heat dissipator through the one or more holes.