The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2013
Filed:
Jun. 13, 2011
Applicant:
Rickie C. Lake, Meridian, ID (US);
Inventor:
Rickie C. Lake, Meridian, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
Methods, devices, and systems for wafer processing are described herein. One method of wafer processing includes modifying a peripheral edge of a wafer to create a number of edge surfaces substantially perpendicular to a number of dicing paths and dicing the wafer along the number of dicing paths. In one or more embodiments, the method includes modifying the peripheral edge of the wafer with a first tool and dicing the wafer with a second tool different from the first tool.