The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2013
Filed:
Nov. 22, 2010
Hsing-kuo Hsia, Jhubei, TW;
Chih-kuang Yu, Chiayi, TW;
Hung-yi Kuo, Taipei, TW;
Hung-wen Huang, Hsinchu, TW;
Hsing-Kuo Hsia, Jhubei, TW;
Chih-Kuang Yu, Chiayi, TW;
Hung-Yi Kuo, Taipei, TW;
Hung-Wen Huang, Hsinchu, TW;
TSMC Solid State Lighting Ltd., Hsinchu, TW;
Abstract
Provided is a method of fabricating a light-emitting diode (LED) device. The method includes providing a wafer. The wafer has light-emitting diode (LED) devices formed thereon. The method includes immersing the wafer into a polymer solution that has a surface tension lower than that of acetic acid. The polymer solution contains a liquid polymer and phosphor particles. The method includes lifting the wafer out of the polymer solution at a substantially constant speed. The method includes drying the wafer. The above processes form a conformal coating layer at least partially around the LED devices. The coating layer includes the phosphor particles. The coating layer also has a substantially uniform thickness.