The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2013

Filed:

Nov. 10, 2009
Applicants:

Nels Jewell-larsen, Campbell, CA (US);

Kenneth A. Honer, Santa Clara, CA (US);

Matt Schwiebert, San Jose, CA (US);

Hongyu Ran, Mountain View, CA (US);

Piyush Savalia, San Jose, CA (US);

Yan Zhang, San Jose, CA (US);

Inventors:

Nels Jewell-Larsen, Campbell, CA (US);

Kenneth A. Honer, Santa Clara, CA (US);

Matt Schwiebert, San Jose, CA (US);

Hongyu Ran, Mountain View, CA (US);

Piyush Savalia, San Jose, CA (US);

Yan Zhang, San Jose, CA (US);

Assignee:

Tessera, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

In thermal management systems that employ EHD devices to motivate flow of air between ventilated boundary portions of an enclosure, it can be desirable to have some heat transfer surfaces participate in electrohydrodynamic acceleration of fluid flow while providing additional heat transfer surfaces that may not. In some embodiments, both collector electrodes and additional heat transfer surfaces are thermally coupled into a heat transfer path. Collector electrodes then contribute both to flow of cooling air and to heat transfer to the air flow so motivated. The collector electrodes and additional heat transfer surfaces may be parts of a unitary, or thermally coupled, structure that is introduced into a flow path at multiple positions therealong. In some embodiments, the collector electrodes and additional heat transfer surfaces may be proximate each other along the flow path. In some embodiments, the collector electrodes and additional heat transfer surfaces may be separate structures.


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