The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2013
Filed:
Sep. 16, 2010
Chih-hung Hsu, Taipei County, TW;
Huan-wen Chen, Taoyuan County, TW;
Shih-chieh Chiu, Taoyuan County, TW;
Ying-shih Lin, Taoyuan County, TW;
Chih-Hung Hsu, Taipei County, TW;
Huan-Wen Chen, Taoyuan County, TW;
Shih-Chieh Chiu, Taoyuan County, TW;
Ying-Shih Lin, Taoyuan County, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A chip package structure including a carrier, a chip and a molding compound is provided. The chip is disposed on the carrier. The molding compound encapsulates a portion of the carrier and the chip. The top surface of the molding compound has a pin one dot and a pin gate contact. The pin one dot is located at a first corner on the top surface. The pin gate contact is located at a second corner except the first corner. The invention further provides a chip package mold chase and a chip package process using to form the chip package structure.