The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2013

Filed:

Apr. 13, 2012
Applicants:

Jin-mu Yin, Kaohsiung, TW;

Shyh-wei Wang, Hsinchu, TW;

Yen-ming Chen, Chu-Pei, TW;

Inventors:

Jin-Mu Yin, Kaohsiung, TW;

Shyh-Wei Wang, Hsinchu, TW;

Yen-Ming Chen, Chu-Pei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for manufacturing the integrated circuit device comprises providing a substrate having a first region, a second region, and a third region. A first gate stack, a second gate stack, and a third gate stack are formed over the substrate in the first region, the second region, and the third region, respectively. The first gate stack, the second gate stack, and the third gate stack comprise a sacrificial layer over a first dielectric layer. The first gate stack and the second gate stack are removed and a second dielectric layer is formed in the first region and the second region. The portion of second dielectric layer in the first region is transformed into a third dielectric layer by a treatment.


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