The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2013
Filed:
Mar. 30, 2007
Yoshikazu Oshika, Chiyoda-ku, JP;
Masayuki Nakano, Chiyoda-ku, JP;
Yoshikazu Oshika, Chiyoda-ku, JP;
Masayuki Nakano, Chiyoda-ku, JP;
Dowa Electronics Materials Co., Ltd., Tokyo, JP;
Abstract
A solder layer and an electronic device bonding substrate using the layer are provided which avoid deteriorating qualities of the electronic device to be bonded. In a solder layerfree from lead and formed on a substrateor an electronic device bonding substratehaving such a solder layer, the solder layerhas a specific resistance of not more than 0.4 Ω·μm. The electronic device bonding substratecan have a thermal resistance of not more than 0.5 K/W and a thickness of not more than 10 μm. Then, voids contained in the solder layerhave a maximum diameter of not more than 0.5 μm and the substrate can be a submount substrate.