The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2013
Filed:
Mar. 24, 2010
Issaku Sato, Tokyo, JP;
Akira Takaguchi, Toyama, JP;
Issaku Sato, Tokyo, JP;
Akira Takaguchi, Toyama, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Abstract
To enable the molten solder to be partially spouted onto a component-mounting member in a stable state without decreasing the revolutions of a pump which is difficult to set a spouted amount of molten solder, even if a nozzle having a small spouting opening is used in a partial-jet-solder bath. As shown in FIG., an automatic partial-jet-soldering apparatusis provided with a solder baththat has a nozzle base portionand contains molten solder, a pumpthat supplies the molten soldercontained in the solder bathunder a predetermined pressure to the nozzle base portion, plural nozzlesand the like that have predetermined solder-spouting areas and connect the nozzle base portionto spout the molten soldersupplied from the pumpunder the predetermined pressure so that it rises by its surface tension, and a dummy nozzlethat has a solder-spouting area more than that of any of the nozzlesand the like and connects the nozzle base portionto spout the molten soldersupplied from the pumpunder the predetermined pressure, wherein the dummy nozzleis positioned on a position which is nearer the pumpthan the nozzlesand the like.