The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2013
Filed:
Feb. 02, 2011
Sadahiro Kishii, Kawasaki, JP;
Tsuyoshi Kanki, Kawasaki, JP;
Yoshihiro Nakata, Kawasaki, JP;
Yasushi Kobayashi, Kawasaki, JP;
Masato Tanaka, Nagano, JP;
Akio Rokugawa, Nagano, JP;
Sadahiro Kishii, Kawasaki, JP;
Tsuyoshi Kanki, Kawasaki, JP;
Yoshihiro Nakata, Kawasaki, JP;
Yasushi Kobayashi, Kawasaki, JP;
Masato Tanaka, Nagano, JP;
Akio Rokugawa, Nagano, JP;
Fujitsu Limited, Kawasaki, JP;
Shinko Electric Industries Co., Ltd., Nagano-shi, JP;
Abstract
A support substrate includes a first surface and a second surface located above the level of the first surface. Chips are mounted on the first surface. A first insulating film is disposed over each chip. First conductive plugs are connected to the chip extending through each first insulating film. Filler material made of resin filling a space between chips. Wirings are disposed over the first insulating film and the filler material for interconnecting different chips. The second surface, an upper surface of the first insulating film and an upper surface of the filler material are located at the same level.