The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2013
Filed:
Feb. 14, 2011
Heui Gyun Ahn, Seongnam-si, KR;
SE Jung OH, Seoul, KR;
IN Gyun Jeon, Seongnam-si, KR;
Jun Ho Won, Seoul, KR;
Heui Gyun Ahn, Seongnam-si, KR;
Se Jung Oh, Seoul, KR;
In Gyun Jeon, Seongnam-si, KR;
Jun Ho Won, Seoul, KR;
Siliconfile Technologies Inc., Seoul, KR;
Abstract
A method for forming a pad in a wafer with a three-dimensional stacking structure is disclosed. The method includes bonding a device wafer that includes an Si substrate and a handling wafer, thinning a back side of the Si substrate, depositing an anti-reflective layer on the thinned back side of the Si substrate, depositing a back side dielectric layer on the anti-reflective layer, forming vias that pass through the anti-reflective layer and the back side dielectric layer and contact back sides of super contacts which are formed on the Si substrate, and forming a pad on the back side dielectric layer such that the pad is electrically connected to the vias.