The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2013
Filed:
Oct. 08, 2010
Chi-sung OH, Gunpo-si, KR;
Dong-hyuk Lee, Seoul, KR;
Ho-cheol Lee, Yongin-si, KR;
Jang-woo Ryu, Seoul, KR;
Jung-bae Lee, Yongin-si, KR;
Chi-Sung Oh, Gunpo-si, KR;
Dong-Hyuk Lee, Seoul, KR;
Ho-Cheol Lee, Yongin-si, KR;
Jang-Woo Ryu, Seoul, KR;
Jung-Bae Lee, Yongin-si, KR;
Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Abstract
A semiconductor device is provided. The semiconductor device applies data applied through a bump pad on which a bump is mounted through a test pad to a test apparatus such that the reliability of the test can be improved. The amount of test pads is significantly reduced by allowing data output through bump pads to be selectively applied to a test pad. Data and signals applied from test pads are synchronized with each other and applied to bump pads during a test operation such that the reliability of the test can be improved without the need of an additional test chip.