The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2013
Filed:
Sep. 08, 2010
Yuichi Miyazaki, Tokyo, JP;
Yuusuke Satou, Tokyo, JP;
Shinya Kiura, Tokyo, JP;
Yukihiro Kyouden, Tokyo, JP;
Yusuke Hagiwara, Tokyo, JP;
Takeshi Nisizono, Tokyo, JP;
Takeaki Imaizumi, Tokyo, JP;
Yuichi Miyazaki, Tokyo, JP;
Yuusuke Satou, Tokyo, JP;
Shinya Kiura, Tokyo, JP;
Yukihiro Kyouden, Tokyo, JP;
Yusuke Hagiwara, Tokyo, JP;
Takeshi Nisizono, Tokyo, JP;
Takeaki Imaizumi, Tokyo, JP;
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Abstract
The present invention is to provide an electromagnetic wave shielding material including a transparent substrate and a convex pattern layer composed of a conductive composition formed in a prescribed pattern on the transparent substrate, wherein the conductive composition contains conductive particles and a binder resin; and in observation of a transverse cross section of the convex pattern layer by electron microscopic photography, at least a part of the conductive particles has a fused continuation and a method for manufacturing the same. The electromagnetic wave shielding material and the method for manufacturing the same include a configuration capable of achieving a lower surface resistivity in an electromagnetic wave shielding material which is required to achieve a much more reduction in a line width of the pattern, specifically, a reduction to a line width of not more than 30 μm, and more preferably not more than 15 to 20 μm and a treatment method capable of reducing the surface resistivity by an easy and short-time treatment.