The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2013
Filed:
May. 12, 2011
Andy Tsen, Chung-Ho, TW;
Jin-ning Sung, Pingjhen, TW;
Po-feng Tsai, Hsinpu Township, Hsinchu County, TW;
Jong-i Mou, Hsinpu Township, Hsinchu County, TW;
Yen-wei Cheng, New Taipei, TW;
Andy Tsen, Chung-Ho, TW;
Jin-Ning Sung, Pingjhen, TW;
Po-Feng Tsai, Hsinpu Township, Hsinchu County, TW;
Jong-I Mou, Hsinpu Township, Hsinchu County, TW;
Yen-Wei Cheng, New Taipei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
System and method for implementing multi-resolution advanced process control ('APC') are described. One embodiment is a method including obtaining low resolution metrology data and high resolution metrology data related to a process module for performing a process on the wafer. A process variable of the process is modeled as a function of the low resolution metrology data to generate a low-resolution process model and the process variable is modeled as a function of the high resolution metrology data to generate a high-resolution process model. The method further includes calibrating the low resolution process model; combining the calibrated low resolution process model with the high resolution process model to generate a multi-resolution process model that models the process variable as a function of both the low resolution metrology data and the high resolution metrology data; and analyzing a response of the multi-resolution process model and the low and high resolution metrology data to control performance of a process module.