The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2013

Filed:

Apr. 30, 2012
Applicants:

Gerhard Josef Poeppel, Regensburg, DE;

Irmgard Escher-poeppel, Regensburg, DE;

Inventors:

Gerhard Josef Poeppel, Regensburg, DE;

Irmgard Escher-Poeppel, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing a semiconductor device is disclosed. One embodiment includes placing multiple semiconductor chips onto a carrier, each of the semiconductor chips having a first face and a second face opposite to the first face. An encapsulation material is applied over the multiple semiconductor chips and the carrier to form an encapsulating body having a first face facing the carrier and a second face opposite to the first face. A redistribution layer is applied over the multiple semiconductor chips and the first face of the encapsulating body. An array of external contact elements are applied to the second face of the encapsulating body.


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