The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2013
Filed:
Mar. 31, 2009
Wang JO Fei, Hsin-Chu, TW;
Andy Tsen, Chung-Ho, TW;
Ming-yu Fan, Hsin-Chu County, TW;
Jill Wang, Hsinchu, TW;
Jong-i Mou, Hsinpu Township, Hsinchu County, TW;
Wang Jo Fei, Hsin-Chu, TW;
Andy Tsen, Chung-Ho, TW;
Ming-Yu Fan, Hsin-Chu County, TW;
Jill Wang, Hsinchu, TW;
Jong-I Mou, Hsinpu Township, Hsinchu County, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
The present disclosure provides a semiconductor manufacturing method. The method includes performing a first process to a first plurality of semiconductor wafers; determining a sampling rate to the first plurality of semiconductor wafers based on process quality; determining sampling fields and sampling points to the first plurality of semiconductor wafers; measuring a subset of the first plurality of semiconductor wafers according to the sampling rate, the sampling fields and the sampling points; modifying a second process according to the measuring; and applying the second process to a second plurality of semiconductor wafers.