The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2013
Filed:
Jan. 14, 2011
Jung-hoon Kim, Asan-si, KR;
Seong-chan Han, Cheonan-si, KR;
Dong-chun Lee, Asan-si, KR;
Jae-hoon Choi, Cheonan-si, KR;
Sun-kyu Hwang, Asan-si, KR;
Jung-Hoon Kim, Asan-si, KR;
Seong-Chan Han, Cheonan-si, KR;
Dong-Chun Lee, Asan-si, KR;
Jae-Hoon Choi, Cheonan-si, KR;
Sun-Kyu Hwang, Asan-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
A semiconductor module, a socket for the same, and a semiconductor module/socket assembly are disclosed. The semiconductor module includes a printed circuit board including a plurality of semiconductor devices, a plurality of insulating layers and a plurality of metal layers, the plurality of insulating layers and the plurality of metal layers are alternately stacked. Exposed portions of the metal layers are exposed to the outside of the semiconductor module at a first and a second ends of the printed circuit board. The first end and the second end are at opposite ends of the printed circuit board.