The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2013
Filed:
Dec. 18, 2009
Bart A. Mooyman-beck, Aloha, OR (US);
Robert J. Woolhiser, Beaverton, OR (US);
Kevin E. Cosgrove, Portland, OR (US);
Daniel G. Knierim, Beaverton, OR (US);
Bart A. Mooyman-Beck, Aloha, OR (US);
Robert J. Woolhiser, Beaverton, OR (US);
Kevin E. Cosgrove, Portland, OR (US);
Daniel G. Knierim, Beaverton, OR (US);
Tektronix, Inc., Beaverton, OR (US);
Abstract
A method and device for measuring a signal of a die to be placed within a package is disclosed. At least one die as a Device Under Test (DUT) is mounted on a substrate and a chip-type measurement instrument is mounted on the substrate, or embedded into the substrate, wherein the instrument analyzes and/or processes the signal of the DUT and may provide stimulus signal to the DUT. The substrate having the DUT and the measurement instrument is mounted on a circuit board that has plural electrodes to be connected to the signal paths of the DUT and the instrument. An electrode is coupled to a standard interface port to provide the signal of the chip-type instrument to an external instrument.