The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2013
Filed:
Sep. 21, 2010
Applicants:
Soeren Zenner, Dresden, DE;
Gotthard Jungnickel, Radeberg, DE;
Frank Kuechenmeister, Dresden, DE;
Inventors:
Assignee:
Globalfoundries Inc., Grand Cayman, KY;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
In sophisticated semiconductor devices, the metal-containing layer stack at the back side of the substrate may be provided so as to obtain superior adhesion to the semiconductor material in order to reduce the probability of creating leakage paths in a bump structure upon separating the substrate into individual semiconductor chips. For this purpose, in some illustrative embodiments, an adhesion layer including a metal and at least one non-metal species may be used, such as titanium oxide, in combination with further metal-containing materials, such as titanium, vanadium and gold.