The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2013
Filed:
Dec. 29, 2009
Applicants:
Edris M. Mohammed, Beaverton, OR (US);
Hinmeng AU, San Jose, CA (US);
Inventors:
Edris M. Mohammed, Beaverton, OR (US);
Hinmeng Au, San Jose, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/00 (2006.01); H05K 1/11 (2006.01); H05K 7/10 (2006.01); H05K 1/18 (2006.01); H01L 23/58 (2006.01); H01L 23/04 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
Embodiments are directed to an apparatus and fabrication method to form pad arrays on the edge of a substrate wafer substrate. Embodiments of the invention make it possible for surface mount devices to be bonded vertically (i.e. on their side) using standard semiconductor assembly processes.