The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2013
Filed:
Dec. 31, 2007
Chang Soo Woo, Gyeonggi-do, KR;
Hyun Hoo Sung, Gyeonggi-do, KR;
Jin Hee Bae, Gyeonggi-do, KR;
Dong Seon Uh, Gyeonggi-do, KR;
Jong Seob Kim, Daejeon, KR;
Chang Soo Woo, Gyeonggi-do, KR;
Hyun Hoo Sung, Gyeonggi-do, KR;
Jin Hee Bae, Gyeonggi-do, KR;
Dong Seon Uh, Gyeonggi-do, KR;
Jong Seob Kim, Daejeon, KR;
Cheil Industries, Inc., Gumi-si, Gyeongsangbuk-do, KR;
Abstract
A compound for filling small gaps in a semiconductor device and a composition comprising the compound are provided. The composition can completely fill holes having a diameter of 70 nm or less and an aspect ratio (i.e. height/diameter ratio) of 1 or more in a semiconductor substrate without any defects, e.g., air voids, by a general spin coating technique. In addition, the composition can be completely removed from holes at a controllable rate without leaving any residue by the treatment with a hydrofluoric acid solution after being cured by baking. Furthermore, the composition is highly stable during storage.