The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2013

Filed:

Jul. 23, 2008
Applicants:

Franz Schrank, Graz, AT;

Martin Schrems, Eggersdorf, AT;

Jochen Kraft, Oberaich, AT;

Inventors:

Franz Schrank, Graz, AT;

Martin Schrems, Eggersdorf, AT;

Jochen Kraft, Oberaich, AT;

Assignee:

austriamicrosystems AG, Unterpremstaetten, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

The interlayer connection of the substrate is formed by a contact-hole filling () of a semiconductor layer () and metallization () of a recess () in a reverse-side semiconductor layer (), wherein the semiconductor layers are separated from each other by a buried insulation layer (), at whose layer position the contact-hole filling or the metallization ends.


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