The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2013

Filed:

Sep. 20, 2010
Applicants:

Yoshiaki Sugizaki, Kanagawa-ken, JP;

Hideki Shibata, Kanagawa-ken, JP;

Akihiro Kojima, Kanagawa-ken, JP;

Masayuki Ishikawa, Kanagawa-ken, JP;

Hideo Tamura, Kanagawa-ken, JP;

Tetsuro Komatsu, Fukuoka-ken, JP;

Inventors:

Yoshiaki Sugizaki, Kanagawa-ken, JP;

Hideki Shibata, Kanagawa-ken, JP;

Akihiro Kojima, Kanagawa-ken, JP;

Masayuki Ishikawa, Kanagawa-ken, JP;

Hideo Tamura, Kanagawa-ken, JP;

Tetsuro Komatsu, Fukuoka-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
Abstract

According to one embodiment, a light emitting device includes a light emitting chip, an external terminal made of a metal material, and a circuit board. The light emitting chip is mounted on the circuit board via the external terminal. The light emitting chip includes a semiconductor layer, a first electrode, a second electrode, an insulating layer, a first interconnection layer, a second interconnection layer, a first metal pillar, a second metal pillar and a resin layer. The circuit board includes an interconnection bonded to the first metal pillar and the second metal pillar via the external terminal, and a heat radiation material provided on an opposite side of the interconnection and connected to the interconnection.


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