The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2013
Filed:
Apr. 30, 2010
Masahiro Kaneko, Ogaki, JP;
Daiki Komatsu, Ogaki, JP;
Satoru Kose, Ogaki, JP;
Hirokazu Higashi, Ogaki, JP;
Masahiro Kaneko, Ogaki, JP;
Daiki Komatsu, Ogaki, JP;
Satoru Kose, Ogaki, JP;
Hirokazu Higashi, Ogaki, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A printed wiring board includes an interlayer resin insulation layer having the first surface, the second surface on the opposite side of the first surface, and a penetrating hole for a via conductor, a conductive circuit formed on the first surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and connected to the conductive circuit on the first surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the via conductor exposed from the second surface of the interlayer resin insulation layer through the penetrating hole. The via conductor is made of a first conductive layer formed on the side wall of the penetrating hole and a plated-metal filling the penetrating hole. The surface of the via conductor is recessed from the second surface of the interlayer resin insulation layer.