The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2013
Filed:
Mar. 10, 2010
Shinichi Uchida, Kanagawa, JP;
Masayuki Furumiya, Kanagawa, JP;
Hiroshi Sakakibara, Kanagawa, JP;
Takashi Iwadare, Kanagawa, JP;
Yoshiyuki Sato, Kanagawa, JP;
Makoto Eguchi, Aichi, JP;
Masato Taki, Aichi, JP;
Hidetoshi Morishita, Aichi, JP;
Kozo Kato, Aichi, JP;
Jun Morimoto, Aichi, JP;
Shinichi Uchida, Kanagawa, JP;
Masayuki Furumiya, Kanagawa, JP;
Hiroshi Sakakibara, Kanagawa, JP;
Takashi Iwadare, Kanagawa, JP;
Yoshiyuki Sato, Kanagawa, JP;
Makoto Eguchi, Aichi, JP;
Masato Taki, Aichi, JP;
Hidetoshi Morishita, Aichi, JP;
Kozo Kato, Aichi, JP;
Jun Morimoto, Aichi, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota-Shi, JP;
Abstract
A first semiconductor chip includes a first inductor and a second inductor, and a second semiconductor chip includes a third inductor and a fourth inductor. The first inductor is connected to a first receiving circuit of the first semiconductor chip, and the second inductor is connected to a second transmitting circuit of the second semiconductor chip through a first bonding wire. The third inductor is connected to a second receiving circuit of the second semiconductor chip, and the fourth inductor is connected to a first transmitting circuit of the first semiconductor chip through a second bonding wire.