The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2013

Filed:

Sep. 16, 2010
Applicants:

Yoshiaki Sugizaki, Kanagawa-ken, JP;

Hideki Shibata, Kanagawa-ken, JP;

Akihiro Kojima, Kanagawa-ken, JP;

Masayuki Ishikawa, Kanagawa-ken, JP;

Hideo Tamura, Kanagawa-ken, JP;

Tetsuro Komatsu, Fukuoka-ken, JP;

Inventors:

Yoshiaki Sugizaki, Kanagawa-ken, JP;

Hideki Shibata, Kanagawa-ken, JP;

Akihiro Kojima, Kanagawa-ken, JP;

Masayuki Ishikawa, Kanagawa-ken, JP;

Hideo Tamura, Kanagawa-ken, JP;

Tetsuro Komatsu, Fukuoka-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
Abstract

According to one embodiment, a semiconductor light emitting device includes a plurality of semiconductor layers, a first electrode, a second electrode, an insulating layer, a first interconnection layer, a second interconnection layer, a first metal pillar, a second metal pillar and a resin layer, and is mounted in a bent state on a curved surface. The plurality of semiconductor layers includes a first main surface, a second main surface opposite to the first main surface, and a light emitting layer, the plurality of semiconductor layers being separated from one another. A material is provided between the plurality of the semiconductor layers separated from one another. The member has a higher flexibility than the semiconductor layers being.


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