The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2013
Filed:
Jan. 25, 2008
Fabio Zürcher, Brisbane, CA (US);
Wenzhuo Guo, Cupertino, CA (US);
Joerg Rockenberger, Redwood City, CA (US);
Vladimir K. Dioumaev, Mountain View, CA (US);
Brent Ridley, San Carlos, CA (US);
Klaus Kunze, Albuquerque, NM (US);
James Montague Cleeves, Redwood City, CA (US);
Fabio Zürcher, Brisbane, CA (US);
Wenzhuo Guo, Cupertino, CA (US);
Joerg Rockenberger, Redwood City, CA (US);
Vladimir K. Dioumaev, Mountain View, CA (US);
Brent Ridley, San Carlos, CA (US);
Klaus Kunze, Albuquerque, NM (US);
James Montague Cleeves, Redwood City, CA (US);
Kovio, Inc., San Jose, CA (US);
Abstract
Methods for forming doped silane and/or semiconductor thin films, doped liquid phase silane compositions useful in such methods, and doped semiconductor thin films and structures. The composition is generally liquid at ambient temperatures and includes a Group IVA atom source and a dopant source. By irradiating a doped liquid silane during at least part of its deposition, a thin, substantially uniform doped oligomerized/polymerized silane film may be formed on a substrate. Such irradiation is believed to convert the doped silane film into a relatively high-molecular weight species with relatively high viscosity and relatively low volatility, typically by cross-linking, isomerization, oligomerization and/or polymerization. A film formed by the irradiation of doped liquid silanes can later be converted (generally by heating and annealing/recrystallization) into a doped, hydrogenated, amorphous silicon film or a doped, at least partially polycrystalline silicon film suitable for electronic devices. Thus, the present invention enables use of high throughput, low cost equipment and techniques for making doped semiconductor films of commercial quality and quantity from doped 'liquid silicon.'