The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2013
Filed:
Jun. 20, 2008
Katsuhiko Tanno, Ibi-gun, JP;
Katsuhiko Tanno, Ibi-gun, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A method for manufacturing a printed wiring board, the method including forming a solder resist layer having a small-diameter aperture and a large-diameter aperture, each aperture exposing a respective joint pad. A metal ball having a first diameter is mounted in the small-diameter aperture by using a mask for small diameter metal balls, which includes a small-diameter aperture area that corresponds to the small-diameter aperture on the solder resist layer. A metal ball having a second diameter larger than the first diameter is mounted in the large-diameter aperture by using a mask for large diameter metal balls, which includes a large-diameter aperture area that corresponds to the large-diameter aperture on the solder resist layer. A small-diameter bump is formed from the metal ball having a first diameter and a large-diameter bump is formed from the metal ball having a second diameter by heating each of the metal ball with a first diameter and the metal ball with a second diameter to at least their respective reflow temperatures.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile