The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2013
Filed:
Dec. 27, 2005
Osamu Asano, Kyoto, JP;
Hitoo Iwasa, Osaka, JP;
Sumio Terakawa, Osaka, JP;
Masami Shouji, Osaka, JP;
Osamu Asano, Kyoto, JP;
Hitoo Iwasa, Osaka, JP;
Sumio Terakawa, Osaka, JP;
Masami Shouji, Osaka, JP;
AAC Technologies Japan R&D Center Co., Ltd., Osaka, JP;
Abstract
There are provided image pickup devices capable of significantly increasing production yield and ensuring long-term reliability and a method for manufacturing the image pickup devices. This invention is characterized in that it has a large number of light-receiving portionsformed at a surface portion of a waferand a microlensformed for each of the light-receiving portions, through electrodesfor performing supply of power to the light-receiving portionsand passing and reception of an electrical signal are provided all over the periphery of the wafer, one end of each through electrodeis connected to an electrode padwhich is connected to a wire leading to a light-receiving element at the surface portion of the wafer, the other end is connected to a wire through a back electrode, a ribwhich serves as a partition portion arranged to surround the microlenseson four sides is provided on the surface of the wafer, a transparent plateof optical glass or the like is bonded to an upper surface of the ribwith adhesive, and a protective frameis provided at a junction between the riband the transparent plate