The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2013
Filed:
Mar. 05, 2010
Hiroyuki Nakamura, Tokyo, JP;
Akira Muto, Tokyo, JP;
Nobuya Koike, Tokyo, JP;
Atsushi Nishikizawa, Tokyo, JP;
Yukihiro Sato, Tokyo, JP;
Katsuhiko Funatsu, Tokyo, JP;
Hiroyuki Nakamura, Tokyo, JP;
Akira Muto, Tokyo, JP;
Nobuya Koike, Tokyo, JP;
Atsushi Nishikizawa, Tokyo, JP;
Yukihiro Sato, Tokyo, JP;
Katsuhiko Funatsu, Tokyo, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
To prevent, in a resin-sealed type semiconductor package, generation of cracks in a die bonding material used for mounting of a semiconductor chip. A semiconductor chip is mounted over the upper surface of a die pad via a die bonding material, followed by sealing with an insulating resin. The top surface of the die pad to be brought into contact with the insulating resin is surface-roughened, while the bottom surface of the die pad and an outer lead portion are not surface-roughened.