The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2013
Filed:
Jan. 19, 2010
Cyril Cabral, Jr., Mahopac, NY (US);
Michael S. Gordon, Yorktown Heights, NY (US);
David F. Heidel, Mahopac, NY (US);
Conal Eugene Murray, Yorktown Heights, NY (US);
Kenneth Parker Rodbell, Sandy Hook, CT (US);
Henry Hong Ki Tang, Poughkeepsie, NY (US);
Cyril Cabral, Jr., Mahopac, NY (US);
Michael S. Gordon, Yorktown Heights, NY (US);
David F. Heidel, Mahopac, NY (US);
Conal Eugene Murray, Yorktown Heights, NY (US);
Kenneth Parker Rodbell, Sandy Hook, CT (US);
Henry Hong Ki Tang, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method is disclosed that includes providing a semiconductor substrate having one or more device levels including a number of devices, and forming a number of wiring levels on a top surface of the one or more device levels, wherein one or more of the number of wiring levels includes one or more alpha particle blocking shields situated between at least one of the number of devices and a predetermined first location where a terminal pad will be formed in one of the wiring levels, the one or more alpha particle blocking shields placed at a second location, having one or more widths, and occupying a predetermined number of the wiring levels, sufficient to prevent a predetermined percentage of alpha particles of a selected energy or less expected to be emitted from an alpha particle emitting metallization to be formed adjacent and connected to the terminal pad from reaching the one device.