The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2013
Filed:
Dec. 09, 2011
Dong-kil Yim, Sungnam, KR;
John M. White, Hayward, CA (US);
Soo Young Choi, Fremont, CA (US);
Han Byoul Kim, Chon An, KR;
Jin Man Ha, Yuseong-gu, KR;
Beom Soo Park, San Jose, CA (US);
Dong-Kil Yim, Sungnam, KR;
John M. White, Hayward, CA (US);
Soo Young Choi, Fremont, CA (US);
Han Byoul Kim, Chon An, KR;
Jin Man Ha, Yuseong-gu, KR;
Beom Soo Park, San Jose, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A method for preventing particle contamination within a processing chamber is disclosed. Preheating the substrate within the processing chamber may cause a thermophoresis effect so that particles within the chamber that are not adhered to a surface may not come to rest on the substrate. One method to increase the substrate temperature is to plasma load the substrate. Plasma loading comprises providing an inert gas plasma to the substrate to heat the substrate. Another method to increase the substrate temperature is high pressure loading the substrate. High pressure loading comprises heating the substrate while increasing the chamber pressure to between about 1 Torr and about 10 Torr. By rapidly increasing the substrate temperature within the processing chamber prior to substrate processing, particle contamination is less likely to occur.