The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2013
Filed:
Mar. 13, 2009
Richard Alfred Beaupre, Pittsfield, MA (US);
Arun Virupaksha Gowda, Rexford, NY (US);
Ljubisa Dragol Jub Stevanovic, Clifton Park, NY (US);
Stephen Adam Solovitz, Portland, OR (US);
Richard Alfred Beaupre, Pittsfield, MA (US);
Arun Virupaksha Gowda, Rexford, NY (US);
Ljubisa Dragol jub Stevanovic, Clifton Park, NY (US);
Stephen Adam Solovitz, Portland, OR (US);
General Electric Company, Schenectady, NY (US);
Abstract
A power module includes one or more semiconductor power devices having a power overlay (POL) bonded thereto. A first heat sink is bonded to the semiconductor power devices on a side opposite the POL. A second heat sink is bonded to the POL opposite the side of the POL bonded to the semiconductor power devices. The semiconductor power devices, POL, first channel heat sink, and second channel heat sink together form a double side cooled power overlay module. The second channel heat sink is bonded to the POL solely via a compliant thermal interface material without the need for planarizing, brazing or metallurgical bonding.