The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2013
Filed:
Oct. 01, 2010
Applicants:
Gerald Ofner, Singapore, SG;
Swain Hong Yeo, Singapore, SG;
Mary Teo, Singapore, SG;
Pei Siang Lim, Singapore, SG;
Khoon Lam Chua, Singapore, SG;
Inventors:
Gerald Ofner, Singapore, SG;
Swain Hong Yeo, Singapore, SG;
Mary Teo, Singapore, SG;
Pei Siang Lim, Singapore, SG;
Khoon Lam Chua, Singapore, SG;
Assignee:
Infinenon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of forming an integrated circuit package, such as a Flip Chip package, in which a void is provided in the underfill material in the central region of the package between the chip or die and the substrate on which the chip or die is mounted. This reduces delamination of the package as a result of moisture.