The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 15, 2013

Filed:

Sep. 03, 2010
Applicants:

Jung-do Lee, Uiwang-si, KR;

Jongkook Kim, Hwaseong-si, KR;

Seok Won Lee, Seongnam-si, KR;

Jaesik Lee, Hwaseong-si, KR;

Hohyeuk Im, Seoul, KR;

Su-min Park, Ansan-si, KR;

Inventors:

Jung-Do Lee, Uiwang-si, KR;

Jongkook Kim, Hwaseong-si, KR;

Seok Won Lee, Seongnam-si, KR;

Jaesik Lee, Hwaseong-si, KR;

Hohyeuk Im, Seoul, KR;

Su-min Park, Ansan-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is a semiconductor chip. The semiconductor chip includes a semiconductor substrate including a main chip region and a scribe lane region surrounding the main chip region. An insulating layer is disposed over the semiconductor substrate. A guard ring is disposed in the insulating layer in the scribe lane region. The guard ring surrounds at least a portion of the main chip region. The guard ring has a brittleness greater than a brittleness of the insulating layer.


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