The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8354730 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 15, 2013

Filed:

Aug. 25, 2006
Applicants:

Satoshi Moriya, Akishima, JP;

Toshio Saito, Akiruno, JP;

Goichi Yokoyama, Iruma, JP;

Tsuyoshi Fujiwara, Hamura, JP;

Hidenori Sato, Ome, JP;

Nobuaki Miyakawa, Wako, JP;

Inventors:

Satoshi Moriya, Akishima, JP;

Toshio Saito, Akiruno, JP;

Goichi Yokoyama, Iruma, JP;

Tsuyoshi Fujiwara, Hamura, JP;

Hidenori Sato, Ome, JP;

Nobuaki Miyakawa, Wako, JP;

Assignees:

Hitachi, Ltd., Tokyo, JP;

Honda Motor Co., Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/70 (2006.01);
U.S. Cl.
CPC ...
Abstract

A structure obtaining a desired integrated circuit by sticking together a plurality of semiconductor substrates and electrically connecting integrated circuits formed on semiconductor chips of the respective semiconductor substrates is provided, and a penetrating electrode penetrating between a main surface and a rear surface of each of the semiconductor substrates and a penetrating separation portion separating the penetrating electrode are separately arranged. Thereby, after forming an insulation trench portion for formation of the penetrating separation portion on the semiconductor substrate, a MIS•FET is formed, and then, a conductive trench portion for formation of the penetrating electrode can be formed. Therefore, element characteristics of a semiconductor device having a three-dimensional structure can be improved.


Find Patent Forward Citations

Moriya, Satoshi. (2013). Manufacturing method of semiconductor device and semiconductor device (U.S. Patent No. 8354730). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8354730

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