The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 15, 2013

Filed:

Feb. 23, 2010
Applicants:

Brian Matthew Henderson, Escondido, CA (US);

Arvind Chandrasekaran, San Diego, CA (US);

Inventors:

Brian Matthew Henderson, Escondido, CA (US);

Arvind Chandrasekaran, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

Mitigating electrostatic discharge damage when fabricating a 3-D integrated circuit package, wherein in one embodiment when a second tier die is placed in contact with a first tier die, conductive bumps near the perimeter of the second tier die that are electrically coupled to the substrate of the second tier die make contact with corresponding conductive bumps on the first tier die that are electrically coupled to the substrate of first tier die before other signal conductive bumps and power conductive bumps on the second tier and first tier dice make electrical contact.


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