The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2013
Filed:
Aug. 11, 2009
Kevin S. Petrarca, Newburgh, NY (US);
Matthew Angyal, Stormville, NY (US);
Lawrence A. Clevenger, LaGrangeville, NY (US);
Carl Radens, LaGrangeville, NY (US);
Brian C. Sapp, Gainesville, FL (US);
Kevin S. Petrarca, Newburgh, NY (US);
Matthew Angyal, Stormville, NY (US);
Lawrence A. Clevenger, LaGrangeville, NY (US);
Carl Radens, LaGrangeville, NY (US);
Brian C. Sapp, Gainesville, FL (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An aluminum lateral interconnect of a Back End of the Line (BEOL) is used to define the x and y dimensions of a through-silicon via in a semiconductor chip formed in a silicon substrate. The TSV includes one or more aluminum annulus formed on a surface of the substrate, and a deep trench in the substrate having a diameter that is determined by the diameter of the aluminum annulus. The annulus can also be provided with a conductive strap upon which a capacitor can be formed. The strap can also be used to provide a connection of the TSV to other BEOL interconnects.