The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2013

Filed:

Oct. 28, 2010
Applicant:

Takuya Oda, Nagano, JP;

Inventor:

Takuya Oda, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor package includes a wiring board, a semiconductor device mounted on the wiring board, an electrically-conductive thermal interface material provided on the semiconductor device, a test electrode in contact with a first surface of the thermal interface material to be electrically connected to the thermal interface material, and an electrically-conductive heat spreader in contact with a second surface of the thermal interface material opposite to its first surface.


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