The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2013
Filed:
Jul. 22, 2009
Applicant:
Toru Hinomura, Osaka, JP;
Inventor:
Toru Hinomura, Osaka, JP;
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/535 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device includes: a metal-containing compound layer on a semiconductor substrate; a dielectric film on the semiconductor substrate and the metal-containing compound layer; a contact hole penetrating through the dielectric film to reach the metal-containing compound layer; a contact plug in the contact hole. The semiconductor device further includes a manganese oxide layer extending between the contact plug and respective one of the dielectric film and the metal-containing compound layer.
Hinomura, Toru. (2013). Semiconductor device and fabrication method thereof (U.S. Patent No. 8344508). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8344508
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile