The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2013
Filed:
Dec. 29, 2009
Chia-liang Hsu, Hsinchu, TW;
Shu-ting Hsu, Hsinchu, TW;
Min-hsun Hsieh, Hsinchu, TW;
Chih-chiang LU, Hsinchu, TW;
Alexander Wang, Hsinchu, TW;
Chia-Liang Hsu, Hsinchu, TW;
Shu-Ting Hsu, Hsinchu, TW;
Min-Hsun Hsieh, Hsinchu, TW;
Chih-Chiang Lu, Hsinchu, TW;
Alexander Wang, Hsinchu, TW;
Epistar Corporation, Hsinchu, TW;
Abstract
The application discloses a light-emitting diode chip level package structure including: a permanent substrate having a first surface and a second surface; a first electrode on the first surface; a second electrode on the second surface; an adhesive layer on where the first surface of the permanent substrate is not covered by the first electrode; a growth substrate on the adhesive layer; a patterned semiconductor structure on the growth substrate; a third electrode and a fourth electrode on the patterned semiconductor structure and electrically connect with the patterned semiconductor structure; an electrical connecting structure on the sidewall of the patterned semiconductor structure electrically connecting the third electrode and the fourth electrode with the first electrode; and an insulation layer located on the side wall of the patterned semiconductor structure and between the electrical connecting structure for electrically insulating the patterned semiconductor structure.