The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2013

Filed:

Jul. 11, 2008
Applicants:

Toshiaki Takeyama, Funabashi, JP;

Naohiko Suemura, Sodegaura, JP;

Inventors:

Toshiaki Takeyama, Funabashi, JP;

Naohiko Suemura, Sodegaura, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08L 63/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is provided a liquid preparation for forming an epoxy resin having curing properties combining high transparency and high bending strength while maintaining advantageous handling properties as in a liquid state. A liquid preparation for forming an epoxy resin comprising: an A agent; and a B agent; wherein the A agent contains a modified epoxy resin (I) formed from at least one type of compound (i) having in a molecule thereof, at least one functional group of Formula (1): (where Rand Rindividually represent an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a heterocyclic group or a halogenated, aminated or nitrated derivative of any of the groups) and a compound (ii) having a glycidyl group in a molecule thereof, and an inorganic particle (II); and the B agent contains a curing agent (III). A liquid preparation for forming an epoxy resin comprising: an A' agent; and a B′ agent; wherein the A′ agent contains the modified epoxy resin (I); and the B′ agent contains the inorganic particle (II) and the curing agent (III).


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