The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2013

Filed:

Apr. 30, 2009
Applicants:

Gabriel Lorimer Miller, Eastham, MA (US);

Manoocher Birang, Los Gatos, CA (US);

Nils Johansson, Los Gatos, CA (US);

Boguslaw A. Swedek, Cupertino, CA (US);

Dominic J. Benvegnu, La Honda, CA (US);

Inventors:

Gabriel Lorimer Miller, Eastham, MA (US);

Manoocher Birang, Los Gatos, CA (US);

Nils Johansson, Los Gatos, CA (US);

Boguslaw A. Swedek, Cupertino, CA (US);

Dominic J. Benvegnu, La Honda, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A system method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of a substrate. At least a portion of the top surface is substantially coplanar with the polishing surface. A sensor is provided to measure a lateral displacement of the substrate contacting member. Some embodiments may provide accurate endpoint detection during chemical mechanical polishing to indicate the exposure of an underlying layer.


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